TIC800A Manufacture 2.5W Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
The TIC®800A series is a high-performance,cost-effective thermal interface material featuring a unique grain-oriented structure that enables precise conformity to device surfaces, thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°C, the material softens and undergoes phase change,effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface, significantly improving heat dissipation performance.
Features
> Low thermal resistance
> Self-adhesive with no need for additional surface adhesives
> Low-pressure application environment
Applications
> Power conversion equipment
> Power supply and vehicle storage battery
> Large communication switch hardware
> LED TV,Lighting
> Laptop computer
| Typical Properties of TIC®800A Series |
| Product Name | TIC®805A | TIC®806A | TIC®808A | TIC®810A | TIC®820A | Testing standards |
| Color | Gray | Visual |
| Composite Thickness | 0.005" | 0.006" | 0.008" | 0.010" | 0.020" | ASTM D374 |
| (0.127mm) | (0.152mm) | (0.203mm) | (0.254mm) | (0.508mm) |
| Density | 2.5g/cc | ASTM D792 |
| Work temperature | -40℃～125℃ | Ziitek Test Method |
| phase transition temperature | 50℃~60℃ | Ziitek Test Method |
| Thermal conductivity | 2.5 W/mK | ASTM D5470 |
| Thermal lmpedance(℃-in²/W) @ 50 psi | 0.055 | 0.06 | 0.062 | 0.074 | 0.095 | ASTM D5470 |
Standard Thicknesses:
0.005"(0.127 mm),0.006"(0.152 mm),0.008"(0.203 mm),0.010" (0.254 mm),0.020"(0.508 mm)
For other thickness options, please contact us.
Standard size: 10”x 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
TIC®800A series is supplied with a white release liner and backing pad.
Die-cutting with half-cut processing can include pull tabs.custom-shaped samples are also available.
Pressure-Sensitive Adhesive: Not applicable to TIC®800A series products.Reinforcement Materal: No reinforcement materialrequired.
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
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TIC800A Manufacture 2.5W Low Melting Point Thermal Interface Materials Thermal Phase Changing Material Images
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